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PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
Datos del producto:
| Lugar de origen: | Porcelana |
| Nombre de la marca: | MK |
| Número de modelo: | MKSP-S630T |
Pago y Envío Términos:
| Cantidad de orden mínima: | 50 piezas |
|---|---|
| Precio: | negotiable |
| Detalles de empaquetado: | Envase de madera contrachapada resistente con material de protección suave adecuado en el interior, |
| Tiempo de entrega: | 10-20 días laborables |
| Condiciones de pago: | LC, D/A, D/P, T/T, Western Union |
| Capacidad de la fuente: | 10000 metros cuadrados por mes |
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Información detallada |
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| Materia prima: | Acero inoxidable doméstico SUS630T de alta calidad. | Espesor estándar: | 1.0-2.0 mm |
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| Ancho máximo: | ≤ 1300 mm | Longitud máxima: | ≤2410 mm |
| Nombre del producto: | Placa de prensa de laminación PCB y CCL SUS630T | Rugosidad de la superficie: | Ra≤0,15μm, Rz≤1,5μm |
| Resaltar: | SUS630T high-hardness lamination press plate,high-temperature resistant steel plate for PCB,corrosion resistant CCL production steel plate |
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Descripción de producto
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
| Feature | Specification & Benefits |
|---|---|
| Raw Material | High-quality domestic SUS630T stainless steel with mature, stable material formula |
| Cost Performance | Reliable industrial-grade lamination quality with highly competitive pricing |
| Thermal Performance | Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings |
| Material Performance | High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability |
| Equipment Compatibility | Universally compatible with all types of industrial lamination steel plate washing machines |
| Application Scenarios | Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes |
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
| Performance Parameter | Mass-Lam Plate (SUS630T) | Pin-Lam Plate (SUS630T) |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Max Width | ≤1300mm | ≤1300mm |
| Max Length | ≤2410mm | ≤2410mm |
| Thickness Tolerance | ±0.10mm | ±0.10mm |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm |
| Positioning Hole Tolerance | -- | ±0.10mm |
| Standard Bushing Slot Tolerance | -- | 0 ~ +0.10mm |
| Warpage Degree | ≤3mm/M | ≤3mm/M |
| Length & Width Tolerance | ±1mm | ±1mm |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Extensibility | ≥5% | ≥5% |
| Hardness | 50HRC±2 | 50HRC±2 |
| Max Working Temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03mm | ≤0.03mm |
| Diagonal Deviation | 1-2mm | 1-2mm |
| Thermal Conductivity (@300℃) | ≥18W/MK | ≥18W/MK |
| Average Thermal Expansion Coefficient | 10~12 (10⁻⁶/℃) | 10~12 (10⁻⁶/℃) |
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